| 摘要 |
This method for producing a flexible printed wiring board comprises: a step for preparing a metal foil-clad laminate (1) which comprises an insulating substrate (2) and metal foils (3, 4) that are provided on at least one main surface of the insulating substrate (2); a step for forming a circuit pattern (5) by patterning the metal foil (3); a step for forming a removable printing plate layer (6) on the insulating substrate so that the circuit pattern is buried therein; a step for forming bottomed holes (7a, 7b), within which the circuit pattern is exposed, by partially removing the printing plate layer; a step for filling the bottomed holes with a conductive paste (8) by printing the conductive paste, while using the printing plate layer as a printing mask; and a step for removing the printing plate layer from the metal foil-clad laminate. A conductive paste is able to be printed on a fine circuit pattern with high accuracy by using the printing plate layer (6), so that a finer circuit pattern is able to be achieved. |
