Mfg. metallic microstructures

摘要

Mfg. metallic microstructures integrated in semiconductor plates comprises: (a) providing a semiconductor plate (1) consisting of a single or several monocrystalline layers with structured openings (2) by anisotropic etching; (b) coating the plate surface with a dielectric film (3), at least in the area of each opening; (c) joining the plate (1) with a contact plate (4) having contact pads (5) in the area of each opening (2); and (e) filling the openings (2) at least partially with metal (7) by electrodeposition.