| 发明名称 |
TEST SOCKET AND MANUFACTURING METHOD OF KNOWN GOOD DIE USING THAT |
| 摘要 |
a substrate (22) which has external contacting nodes (24) connected to an external burn in test substrate; several holes (21) and at least a land patterns (27) connected to the contacting nodes (24); semiconductor chips (26) which have several bonding pads (25); wires (28) which connect the bonding pad (25) to the land pattern (27) electrically; a case which protects the semiconductor chip and wire. |
| 申请公布号 |
KR960008514(B1) |
申请公布日期 |
1996.06.26 |
| 申请号 |
KR19930013979 |
申请日期 |
1993.07.23 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HYUN, INN - HO;LEE, SANG - HYUK;KIM, ILL - WOONG |
| 分类号 |
G01R31/26;G01R1/04;G01R31/28;G01R31/3161;H01L21/66;H01R33/76;(IPC1-7):H01L21/60 |
主分类号 |
G01R31/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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