MULTI-LAYER METAL-WIRING METHOD

摘要

The multi-layer metal wiring method comprises the steps of: formating a barrier layer on a surface where steps are formed by a device separating layer and a poly gate; stacking first aluminum metal layer and a flattening metal layer, and applying a PR on the surface; flattening the upper surface of the PR layer and the flattening metal surface by etching with a same ratio(etch back process); depositing second aluminum metal layer; formating a low metal wiring layer by etching a part of the second aluminum metal layer, metal layer and first aluminum metal layer (patterning process); thereby increasing a step coverage of the device.