发明名称 |
PROCESS OF PRODUCING MULTIPLE-LAYER GLASS-CERAMIC CIRCUIT BOARD |
摘要 |
A process of producing a multiple-layer glassceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body. |
申请公布号 |
CA2070308(C) |
申请公布日期 |
1996.06.25 |
申请号 |
CA19922070308 |
申请日期 |
1992.06.03 |
申请人 |
FUJITSU LIMITED |
发明人 |
SUZUKI, HITOSHI;YAMAGISHI, WATARU;NIWA, KOICHI;HASHIMOTO, KAORU;KAMEHARA, NOBUO |
分类号 |
H01L23/15;H01L21/48;H05K1/03;H05K1/09;H05K3/40;H05K3/46;(IPC1-7):H05K3/12 |
主分类号 |
H01L23/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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