发明名称 Curable resin composition
摘要 The instant invention pertains to a curable resin composition comprised of A) 100 parts by weight curable resin, and B) 0.1-500 parts by weight of an organopolysiloxane having organic groups that contain epoxy groups, which is expressed by the formula: <IMAGE> wherein R1 is a univalent hydrocarbon group excluding alkenyl groups, R2 is a hydrogen atom or a univalent hydrocarbon group excluding alkenyl groups, R3 is an alkoxysilylalkyl group or an organic group that contains epoxy groups, a is 0 or a positive integer, b is a positive integer and c is a positive integer, where a/c has the value of 0 to 4, b/c has the value of 0.05 to 4 and (a+b)/c has the value of 0.2 to 4. The curable resin composition of the instant invention has superior flowability that produces a hardened resin with superior flexibility and adhesion.
申请公布号 US5530075(A) 申请公布日期 1996.06.25
申请号 US19940290574 申请日期 1994.08.15
申请人 DOW CORNING TORAY SILICONE CO., LTD. 发明人 MORITA, YOSHITSUGU;YOKOYAMA, NORIYASU
分类号 C08G59/00;C08G59/30;C08L61/06;C08L63/00;C08L79/08;C08L83/06;C08L83/14;C08L101/00;(IPC1-7):C08L83/00 主分类号 C08G59/00
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