发明名称 MANUFACTURE OF LAYERED CERAMIC ELECTRONIC PARTS
摘要 PURPOSE: To prevent a conductor film consisting of conductive paste from being deformed when a ceramic layer is pressed in the layer direction at the time of manufacturing the layered ceramic electronic parts. CONSTITUTION: Thermoplastic resin, of which glass transition temperature is higher than a temperature to be provided in a press process, is used as the binder to be contained in a conductor paste consisting a conductor film 12 so as to prevent the binder from showing gummy elasticity in the press process, so that deformation of the conductive film 12 is prevented. Thermocuring or ultraviolet ray curing resin also can be used as the binder. In this case, the press process is performed in the state where the binder is subjected to heat or ultraviolet rays so as to be in a cured state.
申请公布号 JPH08167537(A) 申请公布日期 1996.06.25
申请号 JP19940310683 申请日期 1994.12.14
申请人 MURATA MFG CO LTD 发明人 MITSUYA TAMOTSU
分类号 B32B18/00;B28B3/02;B28B11/02;H01B1/16;H01B13/00;H01G4/12;H01G4/30;H05K3/46;(IPC1-7):H01G4/12 主分类号 B32B18/00
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