| 摘要 |
PURPOSE: To dispense with an extra plate and an adhesive by providing a holding means holding a semiconductor ingot to move the same vertically with respect to the running direction of a wire in order to cut the ingot into a wafer and allowing the wafer after the completion of cutting to fall to a wafer housing casette from the holding means. CONSTITUTION: Holding plates 25a, 25b advance to hold the upper part of a semiconductor ingot 24 and, in this state, a wire 23 is allowed to run. When the holding plates 25a, 25b are allowed to fall by a lifter, the slicing of the semiconductor ingot 24 is performed by the wire 23. When the wire 23 approaches the holding plates 25a, 25b, holding plates 26a, 26b advance to hold the lower part of the semiconductor ingot 24 and the holding of the ingot by the holding plates 25a, 25b is released and the holding plates 26a, 26b are allowed to fall by the lifter to continue the slicing of the ingot. At the point of time when slicing is completed, the wire of the uppermost part of a housing cassette is inserted in the gap between wafers and the respective wafers are held by the holding plates 25a, 25b to release the holding of the ingot of the holding plates 26a, 26b and the holding plates 25a, 25b are allowed to fall by the lifter and subsequently released. |
