| 发明名称 |
Double sided wafer, alignment technique |
| 摘要 |
A photolithographed method and pattern for alignment of circuit patterns on a double sided opaque substrate or semiconductor such as a silicon wafer during processing of integrated circuits.
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| 申请公布号 |
US5530552(A) |
申请公布日期 |
1996.06.25 |
| 申请号 |
US19940365275 |
申请日期 |
1994.12.28 |
| 申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY |
发明人 |
MERMAGEN, TIMOTHY;GEIL, BRUCE R. |
| 分类号 |
G03F7/20;G03F9/00;(IPC1-7):G01B11/00 |
主分类号 |
G03F7/20 |
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