| 摘要 |
<p>PURPOSE: To provide a noncontact IC card which has a card top surface in good appearances by facilitating both the assembly of the noncontact IC card which internally has a coil for noncontact transmission to and reception from the external device of an IC module and the connection between the IC module and coil for transmission and reception. CONSTITUTION: The coil 230 for transmission and reception is wound around a thin plate type ferrite core material, the coil 230 for transmission and reception and the IC module 220 are mounted in the transmission/reception coil mount hole 212 and IC module mount hole 211 of a substrate, and the coil 230 for transmission and IC module 220 are connected by the printed wires 215 of the substrate 210, thus forming a substrate module 200. Both the surfaces of the substrate module 200 are coated with plastic surface sheets, and the coil 230 for transmission and reception is made thinner than the substrate 210 or buffer materials are interposed on both the surfaces of the coil 230 for transmission and reception. Consequently, the assembly of the card is facilitated, and the connection between the IC module 220 and coil 230 for transmission and reception is made easy; and the outward appearances of the card surface are good and electric characteristics of the coil 230 for transmission and reception are prevented from being impaired.</p> |
