| 摘要 |
PURPOSE: To obtain a semiconductor device having an improved reliability against corrosion after preventing electric discontinuity of a wire at openings with a measuring probe, by extending a part of a lower interconnection layer to just beneath a measuring pad and connecting it to the measuring pad through the openings. CONSTITUTION: A semiconductor device has a multilayer interconnection layer composed of interconnection layers laminated through interlayer insulation films 13. A measuring pad 14a formed on an uppermost Al interconnection layer 14 and lower interlayer insulation film 13 and a lower Al interconnection layer (corresponding parts to the measuring pads) 12a formed below the pad 14a in approximately the same pattern as the of this pad are connected through openings 13a formed through the film 13 just beneath the pad 14a. |
