| 发明名称 |
BONDING METHOD AND APPARATUS |
| 摘要 |
<p>PURPOSE: To provide a bonder capable of preventing voids in an adhesive agent for bonding a semiconductor chip to die pads. CONSTITUTION: A bonder has a main body 4 for supporting a lead frame 3 having die pads 3a on which a semiconductor chip 2 is mounted with an adhesive agent 1 and heater 7 for heating this agent 1. The main body 4 has suction holes 5 communicating with through-holes 3a1 bored through the pads 3a of the held lead frame 3 and vacuum pump 6 is connected to the holes 5 through which a gas produced from the adhesive agent 1 being heated by the heater 7 is sucked.</p> |
| 申请公布号 |
JPH08167623(A) |
申请公布日期 |
1996.06.25 |
| 申请号 |
JP19940308502 |
申请日期 |
1994.12.13 |
| 申请人 |
HITACHI LTD;HITACHI YONEZAWA ELECTRON CO LTD |
发明人 |
MATSUURA TAKAO |
| 分类号 |
H01L21/52;(IPC1-7):H01L21/52 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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