| 摘要 |
PURPOSE: To provide means for enabling a high density mounting, high density connection, high speed signal transmission, high reliability and low cost for a connection structure of an integrated circuit chip to an interconnection substrate. CONSTITUTION: A flip chip die bonding is made to bond an integrated circuit chip 10 to an interconnection substrate 20 with an adhesive film 30, and connection pads 11 are directly coupled with an interconnection 21 through direct through-hole connections 40 piercing the film 30 and substrate 20 from beneath the pads 11, thus mounting the chip at a high density by reducing the area and thickness. A high density input/out is made by a two-dimensional arrangement of fine connections whereby high-speed signals are transmitted by short wiring connections directly coupled with the chip, high reliability is ensured by the stress dispersion, and low-cost mounting can be made by convenient process facilities. |
