| 摘要 |
<p>PURPOSE: To prevent decrease of the yield of semiconductor chips by preventing peeling off of the formed thin film starting from the clip marks caused by the clips used in sputtering. CONSTITUTION: In the state a wafer S is set to a holder 10 and held by clips 15 to the holder, the holding state is temporarily released when the 50% the predetermined thickness of the a thin film formed by the sputtering on the wafer is attained, the wafer S, on which the thin film 50% of the predetermined thickness is formed, is rotated at very small angle, then the wafer S is held by the clips 15 to the holder 10 again and the sputtering is resumed to form the thin film of the thickness equivalent to the remaining thickness to the predetermined thickness.</p> |
