| 摘要 |
PURPOSE: To allow OMPAC mounting of a chip provided with a large and high power semiconductor element by flip chip mounting the semiconductor chip on a mounting substrate through protruding electrodes called bump electrodes and directly mounting a heat dissipator such as a heat sink on the rear side of the chip. CONSTITUTION: Bump electrodes 2 are formed on a semiconductor chip 1 and the semiconductor chip 1 is turned, permitting the side of the bump electrodes 2 at the bottom, and the semiconductor chip 1 is flip chip mounted by fusing the bump electrodes 2 on a multilayer interconnection board 3. Then, on the rear side of the semiconductor chip 1, a heat dissipator 4 is directly mounted. Then, a space between the chip 1 and the multilayer interconnection board 3 is sealed and the chip 1 and the bump electrodes 2 are protected from the external environment. Namely, the connecting part of the bump electrodes 2 are covered and sealed by filling the space between the chip 1 and the multilayer interconnection board 3 with resin 5. |
