| 摘要 |
PURPOSE: To provide a conductive paste which can prevent the occurrence of the delamination or the crack of a multilayer ceramic board when the conductive paste is used as the conductive material of a multilayer ceramic board, and to provide the conductive body and the multilayer ceramic board using the same. CONSTITUTION: Conductive paste is composed of conductive powder and an organic vehicle, and 99.5 to 90 percentage by weight of Cu and 0.5 to 10 percentage by weight of Ni are contained as the conductive powder. Or, 99.5 to 95 percentage by weight of Cu and 0.5 to 5 percentage by weight of Pd are contained as the conductive powder. Or, 99.5 to 80 percentage by weight of Cu and 0.5 to 20 percentage by weight of W are contained as the conductive powder. Or, 99.5 to 80 percentage by weight of Cu and 0.5 to 20 percentage by weight of Mo are contained as the conductive powder. It is desirable that the average particle diameter of the conductive powder is 0.5 to 5μm. |
