| 发明名称 |
Encapsulated electrical or electronic device |
| 摘要 |
An encapsulated electrical or electronic device having a first layer of electrically insulating material which is then covered by another resin layer filled with thermally conductive fibers such as mesophase pitch based carbon fibers. |
| 申请公布号 |
HK101896(A) |
申请公布日期 |
1996.06.21 |
| 申请号 |
HK19960001018 |
申请日期 |
1996.06.13 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
SHEER, LANA M.;SOLENBERGER, JOHN C. |
| 分类号 |
H01F27/32;H01B3/42;H01F27/02;H01L23/31;H01L23/373;(IPC1-7):H01B3/00 |
主分类号 |
H01F27/32 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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