| 摘要 |
PURPOSE: To increase the welding property of a pressure-bonding ball even if an initial ball is cold by performing wire bonding in order from the electrode at the center of a chip to those at the end. CONSTITUTION: A board mounting a chip 3 is carried to a wire bonding position, and in the wiring bonding position, recognition is performed as to the chip 3, and then wires 11 are bonded continuously to a plurality of electrodes while applying ultrasonic vibration to the wire 3. In such a wire bonding method, wire bonding is performed in order from the electrode at the center of the chip 3 to those at the end. Hereby, at the center of the chip, the fixing by paste is performed firmly as compared with that at the end, so the side of the center of the chip has ultrasonic vibration transmitted more favorably than that at the end, and the welding property of the wire ball is raised. Accordingly, the first bonding trouble of the first wire can be avoided. |
