| 摘要 |
PURPOSE: To obtain a printed wiring board excellent in the interlayer insulation performance in which the resin insulation layer is made thin without sacrificing peeling resistance. CONSTITUTION: In a printed wiring board where a conductor circuit is insulated electrically by a resin insulation layer, the resin insulation layer comprises a lower insulation material layer 2 composed of a heat resistant resin insoluble to acid or oxidizing agent, preferably a heat resistant resin containing an organic resin filler 7 insoluble to acid or oxidizing agent, and an upper adhesive layer 3 for electroless plating composed of heat resistant resin, preferably a heat resistant resin matrix insoluble to acid or oxidizing agent dispersed with heat resistant resin particles soluble to acid or oxidizing agent. This structure provides a printed wiring board excellent in the interlayer insulation stably without lowering the peeling strength even if the resin insulation layer is made thin. |
