| 摘要 |
PURPOSE: To obtain a highly reliable method of bonding pads on an IC chip to bonding bumps by a method wherein the bonding bumps consisting of balls made of a bonding wire are formed on plated bumps formed selectively on the pads on the IC chip. CONSTITUTION: In the case where bumps for bonding to an IC chip are formed on a TAB tape 5 or a mounting substrate 8, plated bumps 3 are selectively formed on pads 2 on the IC chip 1, subsequently bonding bumps 4 consisting of balls made of a bonding wire are formed on the plated bumps 3 and two or more pieces of bonding bumps 4 consisting of balls made of a bonding wire are formed on the pads 2 on the chip 1. Moreover, bonding bumps 4 are formed on the pads 2 on the chip 1 using bonding wires in such a way as to face the bonding bumps 4, which are formed on the substrate 8 and consist of balls made of a bonding wire. |
