| 摘要 |
PURPOSE: To obtain a method wherein cross wiring of a semiconductor chip and an external lead can be easily effected in the manufacture of a semiconductor device in which wiring is carried out by means of a lead frame for an IC. CONSTITUTION: A cross wiring tape 5, consisting of an electrically conductive film 3 on which an anisotropic electrically conductive adhesive 4 is applied, is heated and pressed on a first lead 8a and a second lead 8b of a lead frame 1, wherein the first and second leads are different from each other to make the wiring bonded part of the lead frame 1 and the electrically conductive film 3 conductive. The heat resisting temperature of the cross wiring tape 5 is not lower than 250 deg.C, and the surface of the anisotropic electrically conductive adhesive 4 is treated uneven.
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