| 摘要 |
PURPOSE: To provide a mounting structure for optical transmission module which can transmit wide-band light signals at a high speed. CONSTITUTION: An end surface type semiconductor element 1 which is formed by electrically separating a light emission part 3 perpendicular to the surface of a substrate by a separation groove that reaches the substrate surface from the top surface of a lamination structure having a contact layer formed on the top surface, is used, and the end surface type semiconductor light emission element 1 and an optical fiber 20 are mounted so that the light emission part 3 faces one end surface of the optical fiber 20 and the optical axis 21 of the end surface type semiconductor light emission element 1 or optical fiber 20 is slanted toward the surface of the contact layer at an angleθ, thereby optically connecting the optical fiber 20 and end surface type semiconductor light emission element 1 to each other. |
