| 摘要 |
PURPOSE: To achieve uniform bonding between a semiconductor component and an inner lead of a lead frame and to obtain sufficient bonding quality in a semiconductor device with a LOC structure. CONSTITUTION: Projected part 12d equal in height are formed, at the opposite end parts of an adhesive tape 13 respectively, in an upper surface of an inner lead 12a of a lead frame 12 to be bonded via the adhesive tape 13 on a semiconductor chip 11. Thus, when the lead frame 12 is bonded on the semiconductor chip 11, a pressure block 22 touches only the projected parts 12d of the inner lead 12a thereof. Therefore, in the bonding between the semiconductor chip 11 and the inner lead 12a of the lead frame 12, uniform pressure can be applied on the particularly important parts. |
