| 摘要 |
PURPOSE: To provide a semiconductor device which can be operated normally and stably by always maintaining internal semiconductor element at a lower temperature. CONSTITUTION: A semiconductor device comprises a loading means 1a where a semiconductor element 3 is loaded at the center of upper surface, an insulating base plate 1 having a metallized wiring layer 4 extended to the external circumference from the loading means 1a, a semiconductor element 3 mounted on the loading means 1a of the insulating base plate 1 and connecting an electrode 3a to the metallized wiring layer 4 via a metal bump 5 and a mold resin 7 for covering the insulating base plate 1 and semiconductor element 3. The semiconductor element 3 is provided with a through hole 3b in its thickness direction. |
