| 摘要 |
<p>PURPOSE: To provide a package for containing a semiconductor element which enables easy cleaning of flux remaining between an insulation substrate and a capacitance element and enables normal and stable operation of a semiconductor element for a long period. CONSTITUTION: A package for containing a semiconductor element is formed by forming a connection pad 5a connected to a power supply electrode and a grounding electrode of a semiconductor element 3 to be contained inside an outer surface of a container 4 containing a semiconductor element 3 inside and by fixing an electrode 8a of a capacitance element 8 to the connection pad 5a through a brazing material 9. A through hole 1b which passes through up and down between connection pads 5a whereto the capacitance element 8 is fixed through the brazing material 9 is formed in the container 4.</p> |
