发明名称 WIRE BONDING DEVICE
摘要 PURPOSE: To perform stable wire-bonding by ensuring the fixing to an ultrasonic vibration of a capillary in an ultrasonic thermocompression bonding system of a wiring bonding device, and enable efficient conduction of ultrasonic waves even if the frequency of ultrasonic vibration is increased. CONSTITUTION: A mounting hole 8a for a capillary 11 opened downward and a screw hole 8b being open from the tip of an ultrasonic vibrator 10 and through to the mounting hole 8a are provided at the tip of the ultrasonic vibrator 10. The capillary 11 is attached, roughly vertically to the bonding face 2, in the mounting hole 8a, and it is fixed by fastening the top flank of the capillary 11 in axial direction of the ultrasonic vibrator 10 from the screw hole 8b with a set screw 15. Hereby, the capillary can be surely fixed and stuck close to the ultrasonic vibrator.
申请公布号 JPH08162507(A) 申请公布日期 1996.06.21
申请号 JP19940299289 申请日期 1994.12.02
申请人 HITACHI LTD;HITACHI HOKKAI SEMICONDUCTOR LTD 发明人 SEKI ISAO
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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