SEMICONDUCTOR DEVICE

摘要

PURPOSE: To improve strength of a lead frame by multiple pins and to improve heat dissipation by miniaturization of a chip regarding a a semiconductor device wherein an inner lead of a lead frame and a semiconductor chip are electrically connected and a manufacturing method thereof and a lead frame used for it. CONSTITUTION: A thin plate part 33a is formed in an inner lead 33 of a lead frame 32 and is fixed on a plate-like heat spreader 35 inside a package 39. A semiconductor chip 36 is mounted on the heat spreader 35 and is bonded by a wire 38 between it and a thin plate part 33a of an inner lead.