| 摘要 |
<p>PURPOSE: To provide a semiconductor device having higher reliability in a lead frame fitting structure in which a lead frame hooking projection is pressingly fixed without causing a gap if hole dimension management of a fitting slit of an insulation casing frame is roughed. CONSTITUTION: Hooking projections 81c, 81c are under a twisting condition of a twistγin a reverse direction with respect to each other. A top end of the hooking projection is formed widely oval. The hooking projections 81c, 81c are pressingly inserted into fitting slits c, c formed in an undercut surface 16 of a frame part 12 made of resin to fit to fix a lead frame 81.</p> |
