LEAD FRAME, SEMICONDUCTOR DEVICE UTILIZING THE SAME AND MANUFACTURE OF THE SAME

摘要

PURPOSE: To provide a highly reliable lead frame showing a very small deviation by heat, a semiconductor device utilizing such lead frame and a method of manufacturing the same. CONSTITUTION: In a lead frame 1 having a tab 2 on which a chip forming a semiconductor device is loaded and arranging a plurality of leads 5 toward internal side of the frame 4, a dumb bar 6 made of an insulating resin material is buried between a plurality of leads 5 at the boundary between the outer lead 5a and inner lead 5b at the lead 5 and a filling agent for setting the thermal expansion coefficient of insulating resin to the predetermined value is included in the insulating resin as the material of the dumb bar 6. Moreover, there is provided a method of manufacturing the same semiconductor utilizing a lead frame 1 having a dumb bar 6 made of a particular insulating resin material as explained above.