Keramisches Mehrschichtsubstrat mit Gradienten-Kontaktlöchern.

摘要

Disclosed is a multilayer ceramic substrate (30) for electronic applications including: (a) at least one internal layer (32) having vias (34) filled with a metallic material; (b) at least one sealing layer (40) having vias (42) filled with a composite material that is a mixture of ceramic and metallic materials; and (c) at least one transition layer (46) located between the internal and sealing layers having vias (48) filled with a composite material that is a mixture of ceramic and metallic materials but having less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias. Also disclosed is a method of forming the multilayer ceramic substrate.