发明名称 |
Semiconductor rectifying device and full-wave rectifier fabricated using the same |
摘要 |
<p>A semiconductor rectifying device, suitable for installation in vehicles, comprises a cup-shaped metallic container(1), a semiconductor chip(2) having a pn junction, one of whose main surfaces is bonded to the bottom surface of the container(1), a lead(4) bonded to the other main surface of the semiconductor chip(2), and a silicone resin layer(6) containing silica powder, with which layer an exposed portion of the semiconductor chip(2) is covered. <IMAGE></p> |
申请公布号 |
EP0480372(B1) |
申请公布日期 |
1996.06.19 |
申请号 |
EP19910117134 |
申请日期 |
1991.10.08 |
申请人 |
HITACHI, LTD.;SHIN-ETSU CHEMICAL CO., LTD.;NIPPONDENSO CO., LTD. |
发明人 |
NARITA, KAZUTOYO;NAKAJIMA, YOICHI;OKINOSHIMA, HIROSHIGE;NOSAKA, TADASHI |
分类号 |
H01L25/07;H01L23/24;H01L23/29;H01L23/31;H01L25/11;H02K11/04;(IPC1-7):H01L25/11 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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