发明名称 ANTI-FUSE STRUCTURES AND METHODS FOR MAKING SAME
摘要 <p>An anti-fuse structure characterized by a substrate, an oxide layer formed over the substrate having an opening formed therein, an amorphous silicon material disposed within the opening and contacting the substrate, a conductive protective material, such as titanium tungsten, disposed over the amorphous silicon material, and oxide spacers lining the walls of a recess formed within the protective material. The protective material and the spacers provide tighter programming voltage distributions for the anti-fuse structure and help prevent anti-fuse failure.</p>
申请公布号 EP0597015(B1) 申请公布日期 1996.06.19
申请号 EP19920917139 申请日期 1992.07.24
申请人 VLSI TECHNOLOGY, INC. 发明人 BOARDMAN, WILLIAM, J.;CHAN, DAVID, P.-KWAN;CHANG, KUANG-YEH;GABRIEL, CALVIN, T.;JAIN, VIVEK;NARIANI, SUBHASH, R.
分类号 H01L21/82;H01L21/768;H01L23/525;H01L27/10;(IPC1-7):H01L23/525 主分类号 H01L21/82
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