发明名称 |
ANTI-FUSE STRUCTURES AND METHODS FOR MAKING SAME |
摘要 |
<p>An anti-fuse structure characterized by a substrate, an oxide layer formed over the substrate having an opening formed therein, an amorphous silicon material disposed within the opening and contacting the substrate, a conductive protective material, such as titanium tungsten, disposed over the amorphous silicon material, and oxide spacers lining the walls of a recess formed within the protective material. The protective material and the spacers provide tighter programming voltage distributions for the anti-fuse structure and help prevent anti-fuse failure.</p> |
申请公布号 |
EP0597015(B1) |
申请公布日期 |
1996.06.19 |
申请号 |
EP19920917139 |
申请日期 |
1992.07.24 |
申请人 |
VLSI TECHNOLOGY, INC. |
发明人 |
BOARDMAN, WILLIAM, J.;CHAN, DAVID, P.-KWAN;CHANG, KUANG-YEH;GABRIEL, CALVIN, T.;JAIN, VIVEK;NARIANI, SUBHASH, R. |
分类号 |
H01L21/82;H01L21/768;H01L23/525;H01L27/10;(IPC1-7):H01L23/525 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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