| 摘要 |
<p>A tantalum capacitor chip (20) and lead terminals (21,22) respectively connected to two electrodes of the chip are molded in resin. A portion of the lead terminal, not molded in the resin is bent at a tip side (21b,22b) and at a base side (21a,22a). The resin is provided with a structure in which its upper half (24a) is longer than its lower half (24b) at both sides. The base side (21a,22a) portion of the portion not molded in the resin (21A,22A), of each of the lead terminals is curved downward with a predetermined radius of curvature, and an inwardly bent portion is formed on the tip side (21b,22b) of the base side curved portion (21a,22a) of the protruding portion. <IMAGE></p> |
