Multi-wire saw device, slice method using the same and cassette for housing a wafer sliced with the same

摘要

Two sets of clip boards (25a, 25b; 26a, 26b) for holding a crystalline silicon block (24) therebetween are disposed movable on a wall free to ascend and descend. The multi-wire saw allows the sliced wafer to fall as it is into a cassette (5). As material of a cassette (5), Teflon resin is used and wires (4) as partitions are spanned through the holes bored in the side boards (1a, 1b) of the cassette. <IMAGE>