发明名称 Printed circuit assembly having component locating features
摘要 A printed circuit assembly (5) has a surface mount electronic component (14), circuit board (10), and locating features to align (16) the surface mount electronic component on the printed circuit board. The locating features may comprise solder bumps (24) on the printed circuit board. The locating features are arranged on the surface of the printed circuit board to lie proximal to the main body (22) of the surface mount electronic component. The locating features prevent movement of the surface mount electronic component prior to soldering the surface mount electronic component to the printed circuit board.
申请公布号 US5528461(A) 申请公布日期 1996.06.18
申请号 US19930148245 申请日期 1993.11.08
申请人 MOTOROLA, INC. 发明人 GORE, KIRON;HALL, EDWARD J.;BRINKERHOFF, JOHN B.
分类号 H05K1/02;H05K3/30;H05K3/34;(IPC1-7):H05K7/02 主分类号 H05K1/02
代理机构 代理人
主权项
地址