| 摘要 |
A plating device for a wafer employs an air bag 6, 20 as a holding means for downwardly depressing the wafer 8 upon performing plating on the wafer 8. The air bag 6, 20 constrain only the upper surface 13 of the circumferential edge of the wafer at an expanded state and releases the constraint by contracting to restore an initial configuration at a non-expanded state. By this, the holding means will not occupy the upper side space of the wafer both during plating process and during non-plating process so as to avoid adhering of dust and foreign matter onto the wafer 8. |
