发明名称 |
Method for soldering electronic components |
摘要 |
A method for soldering an electronic component capable of accomplishing satisfactory soldering of an electronic component using paste solder even in an oven constructed into a non-closed structure which causes flowing of an ambient atmosphere. Dehumidified air is introduced through a dehumidified air inlet section into the oven to keep a dehumidified atmosphere in the oven, to thereby prevented activity of flux contained in the paste flux from being deteriorated.
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申请公布号 |
US5526978(A) |
申请公布日期 |
1996.06.18 |
申请号 |
US19940223583 |
申请日期 |
1994.04.06 |
申请人 |
TDK CORPORATION |
发明人 |
NAGATSUKA, TOSHIYUKI;IIJIMA, YUMIKO;OHIRA, HIROYUKI |
分类号 |
B23K1/008;(IPC1-7):B23K31/02 |
主分类号 |
B23K1/008 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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