发明名称 Method for soldering electronic components
摘要 A method for soldering an electronic component capable of accomplishing satisfactory soldering of an electronic component using paste solder even in an oven constructed into a non-closed structure which causes flowing of an ambient atmosphere. Dehumidified air is introduced through a dehumidified air inlet section into the oven to keep a dehumidified atmosphere in the oven, to thereby prevented activity of flux contained in the paste flux from being deteriorated.
申请公布号 US5526978(A) 申请公布日期 1996.06.18
申请号 US19940223583 申请日期 1994.04.06
申请人 TDK CORPORATION 发明人 NAGATSUKA, TOSHIYUKI;IIJIMA, YUMIKO;OHIRA, HIROYUKI
分类号 B23K1/008;(IPC1-7):B23K31/02 主分类号 B23K1/008
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