| 摘要 |
A leadframe (10) formed by a method including providing a preform of silicon carbide, placing the preform in a mold, injecting a liquefied metal, such as aluminum, into the mold to fill the mold and infiltrate the preform, using heat and pressure. The mold defines a mounting area (12) in which the preform is positioned, and a plurality of leads (20, 22, 28, 29). |
