| 摘要 |
PURPOSE: To facilitate adhering of a protective cover to a circuit substrate with an adhesive and facilitate reading of a mark by an LED array head which has, on the top face of the circuit substrate, light emitting semiconductor chips forming a number of light emitting element parts and their controlling semiconductor chips, and has a protective cover made of synthetic resin for covering these semiconductor chips. CONSTITUTION: An adhering base coat 11 is formed at a part on a surface of a circuit substrate 1, to which a bottom face of a protective cover comes in contact, by a white synthetic resin. A marking base coat 12 is formed at a part outside the protective cover on the surface of the circuit substrate by the white synthetic resin. While the protective cover is fixed to the adhering base coat by the adhesive, a mark 13 is affixed or imprinted to the marking base coat. |
