| 摘要 |
PURPOSE: To dispense with cleaning operation of a mold by improving releasability by a method wherein after setting a semiconductor device and a sealing material between a pair of films on a mold, the mold is closed, the sealing material between the films is pressurized, heated, and casted into the cavity to seal a semiconductor package. CONSTITUTION: A film 21 is land on a bottom force 4, and a semiconductor device 23 and a sealing material 24 are positioned inside a cabity 6 and a pot part 8 thereon respectively. Further, a film 25 is laid thereon, and the top and bottom forces 3, 4 are closed. Then, when the sealing material 24 is pressurized while it is heated, the sealing material flows into the cavity 6 through respective runner parts 9 in a state of being put between the films 21, 25, and fills a periphery of the semoconductor device 23 while pushing and expanding the films 25, 21. After hardening the sealing material 24 thus, a semiconductor package 26 is taken out, the films 21, 25 are peeled off from its surface, and an unnecessary molded part 27 is cut off. Consequently there is no fear of staining a surface of the cavity by contact with the sealing material 24. |
