Method for surface treatment of polyimide resin molded articles

摘要

The surface of a polyimide molded article such as polyimide film is treated with a solution containing a basic compound, further treated with a solution containing a silane coupling agent and then subjected to a heat treatment. This greatly improves the adhesiveness of the polyimide molded article surface to the polyimide adhesive layer formed thereon. This invention can be applied to the production of substrates for flexible wiring boards having a polyimide film/polyimide adhesive/copper foil structure.