发明名称 Lapping composition
摘要 A lapping composition which contains abrasive grains which are commercially available and which consists of plate alumina-powder prepared by milling and class:trying a sintered body of plate alumina obtained by calcinating aluminum hydroxide, and other plate alumina powder classified and prepared separately from but similarly to the first-mentioned plate alumina powder having average grain size which is in a range of from 1.3 times to 2.3 times as large as the average grain size of the first-mentioned plate alumina powder. Further provided is a lapping method with such a lapping composition by which the removal rate is improved and a lapped surface excellent in quality can be obtained.
申请公布号 US5527370(A) 申请公布日期 1996.06.18
申请号 US19940261428 申请日期 1994.06.17
申请人 FUJIMI INCORPORATED 发明人 KUBO, MASAAKI;NISHIKAWA, KOJI;MARUYAMA, SHINJI
分类号 B24D3/00;C09C1/40;C09C1/68;C09K3/14;(IPC1-7):C09C1/68 主分类号 B24D3/00
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