Integrated circuit package for burn-in and testing of an integrated circuit die
摘要
A method for and a disassemblable prepackage arrangement for testing and burning-in an integrated circuit die which will be hermetically sealed within and form part of an overall integrated circuit package is herein disclosed. The die has a top and bottom surface and includes a plurality of die input/output terminals. The prepackage comprises a substrate including a top surface. The bottom of the die is disengagably attached to the top surface of the substrate. A lid is disengagably attached to the substrate in a way which hermetically seals the die within a space substantially defined by the substrate and the lid. Thereafter, the die input/output terminals are electrically connecting to external testing equipment for testing and burning-in the die while the die is in a hermetically sealed environment.
申请公布号
US5528157(A)
申请公布日期
1996.06.18
申请号
US19940339780
申请日期
1994.11.15
申请人
NATIONAL SEMICONDUCTOR CORPORATION
发明人
NEWBERRY, WILLIAM R.;MCCLINTICK, MARK A.;FALCONER, ERIC;ARONSON, WILLIAM B.;LIPPOLD, MARK;JOY, DAVID W.