Apparatus for plasma enhanced processing of substrates

摘要

PCT No. PCT/DE92/00471 Sec. 371 Date May 13, 1994 Sec. 102(e) Date May 13, 1994 PCT Filed Jun. 9, 1992 PCT Pub. No. WO92/22920 PCT Pub. Date Dec. 23, 1992.Disclosed is an apparatus for plasma-enhanced processing of substrates, having a recipient in which ions and reactive neutral particles (radicals) formed in plasma act on the substrate. The present invention is distinguished by having means for varying the plasma volume are provided in order to control the absolute values of the ionic current densities and the radical current densities and in order to control the relative ratio of the ionic current densities and the radical current densities on the surface of the substrate.