发明名称 |
Methods of forming electronic packages |
摘要 |
The present invention relates to the formation of a macrocomposite body for use as an electronic package or container. The macrocomposite body is formed by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body or a metal or metal containing body. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform by molten matrix metal, the infiltrated material is bonded to said second material, thereby forming a macrocomposite body. The macrocomposite body may then be coated by techniques according to the present invention to enhance its performance or bonding capabilities.
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申请公布号 |
US5526867(A) |
申请公布日期 |
1996.06.18 |
申请号 |
US19950467482 |
申请日期 |
1995.06.06 |
申请人 |
LANXIDE TECHNOLOGY COMPANY, LP |
发明人 |
KECK, STEVEN D.;ROCAZELLA, MICHAEL A.;ENGELGAU, PETER M.;HANNON, GREGORY E.;WHITE, DANNY R.;NAGELBERG, ALAN S. |
分类号 |
C04B35/65;C04B37/02;C22C1/10;H01L21/48;H01L23/14;H01L23/373;(IPC1-7):B22D19/14 |
主分类号 |
C04B35/65 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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