摘要 |
PURPOSE: To easily control the machining quantity such as the machining position and the machining depth with excellent accuracy, and to achieve the complicated and fine machining in a machining equipment using the laser beam. CONSTITUTION: The mask pattern 15 consisting of an excimer laser oscillator 11, a mask moving stage 13, a mask substrate 14, a mask pattern 15 and a compact optical system 17 is moved in the transverse direction (uni-directional) by the mask moving stage 13, a transmission part of the mask pattern 15 is moved, the irradiation position of the laser beam on a work is changed, and the pulse number of the laser beam with which the work is irradiated is changed in the space. The machining quantity such as the machining position and the machining depth to the work can be controlled with excellent accuracy to enable the machining of the complicate and fine shape. |