| 摘要 |
The present invention provides an easily reworkable demountable means of electrically interconnecting an integrated circuit die to a substrate. The electrical assembly is comprised of an integrated circuit die having contact areas on a first surface, a substrate having contact areas aligned with the contact areas of the die for providing electrical connection to the integrated circuit die, and a compression means for maintaining the integrated circuit die contacts in electrical communication with the contacts of the substrate. The compression means typically includes a two-part spring system which provides superior electrical contact by causing the curvature of the integrated circuit die to be in the same direction as the curvature of the substrate.
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