发明名称 |
Socket for multi-lead integrated circuit packages |
摘要 |
A socket and a method for making a socket for securing an integrated circuit package to a supporting structure. The integrated circuit package has a plurality of leads positioned in a geometric pattern and each lead has a predetermined impedance. The socket comprises a substrate or body having a first and second surface opposed to each other and formed of an insulative material. The socket further comprises a plurality signal path members extending from at least the first surface to the second surface. Each signal path includes a first and second end. One end of each signal path member includes a means positioned to secure a lead of an integrated circuit package and the other end is adapted to be coupled to a conductor on a printed circuit board. A metal pattern or ground plane mesh is defined on at least a surface of the substrate, and coated through holes are defined in the substrate at a predetermined distance such that the impedance of at least one signal path is controlled to match the anticipated impedance of the lead. Further, radio-frequency interference with at least one signal path is suppressed.
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申请公布号 |
US5527189(A) |
申请公布日期 |
1996.06.18 |
申请号 |
US19950492865 |
申请日期 |
1995.06.20 |
申请人 |
BERG TECHNOLOGY, INC. |
发明人 |
MIDDLEHURST, RICHARD J.;KNIGHT, MICHAEL K. |
分类号 |
H01R13/648;G01R1/04;H01R12/16;H01R13/658;H01R24/00;H05K7/10;(IPC1-7):H01R13/648 |
主分类号 |
H01R13/648 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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