| 摘要 |
A test assembly for use in testing electronic components, preferably surface mount IC-circuit components, includes a carrier (4) by means of which a component (2) is picked-up and brought to and held against the conductors (6) on a printed circuit board (5). The printed circuit board (5) includes at least one cavity (9) underneath the contact conductors (6) in the region where the component (2) is to be held, such as to render the conductors resilient. Pressure pads (7) are placed in the cavity (9) between the bottom of the cavity and the contact conductors (6) such as to regulate the resilience of the conductors (6). |
