发明名称 |
Process for catalyzation in electroless plating |
摘要 |
There is disclosed a novel process for catalyzation for trapping of a catalyst metal involved with the adhesion of an electroless plating to a substrate. The process is carried out by employing neither the sensitizing-activating method nor the catalyst-accelerator method. Specifically, in forming an electroless plating on the surface of a non-conductive substance as a substrate, the surface of the non-conductive substance is coated with a treatment liquid containing at least chitosan or a chitosan derivative before the steps of catalyzation and electroless plating to form a hydrophilic coating film on the surface of the non-conductive substance. |
申请公布号 |
AU1358195(A) |
申请公布日期 |
1996.06.13 |
申请号 |
AU19950013581 |
申请日期 |
1995.02.24 |
申请人 |
DAISHIN CHEMICAL CO., LTD;OMURA TORYO CO. LTD |
发明人 |
YOSHIHIKO OMURA |
分类号 |
C23C18/28;C23C18/20;C23C18/22;C23C18/30;F02B75/02;H05K3/18;H05K3/38 |
主分类号 |
C23C18/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|